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A Study of The Rhermal Conductivity Affecting on Low Current Instability Vacuum Arc
http://hdl.handle.net/10458/6786
http://hdl.handle.net/10458/67860b5b75f6-e88b-416a-b949-abcedaafaa29
| 名前 / ファイル | ライセンス | アクション |
|---|---|---|
本文 (401.8 kB)
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| Item type | 会議発表論文 / Conference Paper(1) | |||||
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| 公開日 | 2020-06-21 | |||||
| タイトル | ||||||
| タイトル | A Study of The Rhermal Conductivity Affecting on Low Current Instability Vacuum Arc | |||||
| 言語 | en | |||||
| 言語 | ||||||
| 言語 | eng | |||||
| 資源タイプ | ||||||
| 資源タイプ識別子 | http://purl.org/coar/resource_type/c_5794 | |||||
| 資源タイプ | conference paper | |||||
| 著者 |
W., Ondee
× W., Ondee× S., Arungrungrusmi× N., Kamata× P., Chansri× N., Mungkung× R., Charoenpeng× T, Yuji |
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| 抄録 | ||||||
| 内容記述タイプ | Abstract | |||||
| 内容記述 | This analysis verified the physical mechanism of the thermal conductivity effect on the instability phenomena using the cathode spot model. An analysis of instability arc current is performed by varying thermal conductivity of copper by compound material. It was found that the minimum stability arc is inversely proportion to the thermal conductivity. The low thermal conductivity has an important role for more stability arc than high thermal conductivity cathode material. The thermal conductivity is reduced to increase stable arc current with reducing reversed electron from plasma region. These results were similar to obtained data, indicating that this analysis by the cathode spot model which is used to investigate the thermal conductivity effect in low-current vacuum arc may be valid for volatile materials. | |||||
| 言語 | en | |||||
| 書誌情報 |
en : International Conference on Applied Electrical and Mechanical Engineering 2019 p. 135-168, 発行日 2019-09 |
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| 著者版フラグ | ||||||
| 出版タイプ | VoR | |||||
| 出版タイプResource | http://purl.org/coar/version/c_970fb48d4fbd8a85 | |||||
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W., Ondee, S., Arungrungrusmi, N., Kamata, P., Chansri, N., Mungkung, R., Charoenpeng, T, Yuji, 2019, A Study of The Rhermal Conductivity Affecting on Low Current Instability Vacuum Arc: 135–168 p.
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